Image pickup apparatus and camera module

ABSTRACT

An image pickup apparatus includes an optical device, a transparent conductive film, an electrode pad, and a penetrating electrode. In the optical device, an optical element area for receiving light is formed on a first surface side of a substrate, and an external connection terminal is formed on a side of a second surface opposite to the first surface of the substrate. The transparent conductive film is formed to face the first surface of the substrate. The electrode pad is formed on the first surface of the substrate and configured to perform connection with a fixed potential. The penetrating electrode is connected to the electrode pad and formed to penetrate the substrate between the first surface and second surface. The transparent conductive film is connected to the electrode pad, and the penetrating electrode is connected to the external connection terminal on the side of the second surface of the substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.13/566,401, filed Aug. 3, 2012, which claims the benefit of priorityunder 35 U.S.C. §119 of Japanese Application No. 2011-176125, filed Aug.11, 2011.

BACKGROUND

The present disclosure relates to an image pickup apparatus and a cameramodule in which an optical sensor such as a CCD (charge coupled device)and a CMOS (complementary metal oxide semiconductor) image sensor (CIS)is configured as a chip scale package.

As a simple package method for an optical sensor, a wafer chip scalepackage (WCSP) structure has been proposed.

FIG. 1 is a view showing a basic structure of a WCSP structure.

In a WCSP structure 1, disposed is a sealing glass (cover glass) 3 as asealing material for protecting an upper portion of an optical elementarea 21 serving as a light receiving unit of a front surface of anoptical device 2 serving as an optical sensor (sensor chip).

In the WCSP structure 1, the sealing glass 3 is disposed on a peripheralportion excluding the optical element area (light receiving unit) 21 ofthe optical device 2 with a resin 4 intervened. Therefore, in the WCSPstructure 1, between the light receiving unit 21 of the optical device 2and an opposed surface 31 of the sealing glass 3 with respect to theoptical element area (light receiving unit) 21, a cavity 5 is formed.

In the CSP structure, an electrode 6 is formed with a through siliconvia (TSV) that penetrates the sensor chip from the front surface to theback surface thereof, thereby eliminating wirings using wire bond, whichmakes it possible to bond the glass in a clean room in a wafer state.

As a result, it is possible to attain a size reduction, a costreduction, and a dustless condition as compared to a COB (Chip On Board)type package of a past technique.

FIG. 2 is a view showing another structure of a WCSP structure.

A WCSP structure 1A shown in FIG. 2 is configured as a WCSP structurewith no cavity because the cavity 5 in the WCSP structure 1 shown inFIG. 1 is filled with the resin 4.

In the following description, the WCSP structure with no cavity isreferred to as a cavityless WCSP structure in some cases.

By employing the cavityless CSP structure with no cavity, a thermalstress generated in the cavity of the WCSP structure having a cavity canbe significantly reduced, which can suppress an occurrence of warp.

Further, the cavityless CSP structure can suppress a reflection causedon an interface of the cavity (refractive index: 1) optically with theresin having the refractive index of approximately 1.5, with the resultthat it is possible to attain an increase of a light receiving quantityin the optical device 2.

Incidentally, in a lens-integrated camera module with a WCSP of a CCD ora CMOS image sensor, it is necessary to provide a function of anelectromagnetic susceptibility (EMS) or an electromagnetic compatibility(EMC).

The EMS is a function for preventing a radiation electromagnetic fieldfrom another apparatus near the camera module and natural phenomena suchas thunder and solar activity from inhibiting an operation of anelectronic apparatus and for a protection from an external factor thatcauses a functional degradation of a system, a malfunction, and thelike.

The EMC is a function for preventing the camera module itself frominhibiting an operation of another apparatus and preventing anelectromagnetic interference (EMI) which may be an interference sourceat a certain level or more that affects a human body.

Image pickup apparatuses and camera modules which are equipped with theEMS or the EMC have been proposed (see, for example, Japanese PatentApplication Laid-open Nos. 2010-283597, 2009-158863, and 2010-11230(hereinafter, referred to as Patent Document 1, Patent Document 2, andPatent Document 3, respectively)).

The image pickup apparatus disclosed in Patent Document 1 includes apixel area and has an image pickup element chip, in which a well isformed on a periphery thereof, and a metal shield which is disposed onthe image pickup element chip and electrically connected with the wellof the image pickup element chip.

In the camera module disclosed in Patent Document 2, around an opticaldevice and shield glass, a light and electromagnetic shield is disposed.

The camera module disclosed in Patent Document 3 has a metal evaporationfilm that covers an entire side surface of the camera module.

SUMMARY

However, although the demand for a size reduction of an electronicapparatus is increased year by year, such a structure that a metalshield is attached to the outside of the camera module as disclosed inPatent Documents 1 and 2 makes the module large and makes amanufacturing process complicated, which increases a material cost.

Further, in the structure disclosed in Patent Document 3, the metalevaporation film that covers the lens-integrated camera module iselectrically floated, which degrades the EMC effect.

In view of the above-mentioned circumstances, it is desirable to providean image pickup apparatus and a camera module which can sufficientlyexert the EMC or EMI effect while preventing the increase in size of themodule, the complication of the process, and the increase in cost.

According to an embodiment of the present disclosure, there is providedan image pickup apparatus including an optical device in which anoptical element area for receiving light is formed on a side of a firstsurface of a substrate, and an external connection terminal is formed ona side of a second surface opposite to the first surface of thesubstrate, a transparent conductive film formed to face the firstsurface of the substrate, an electrode pad formed on the first surfaceof the substrate and configured to perform connection with a fixedpotential, and a penetrating electrode connected to the electrode padand formed to penetrate the substrate between the first surface andsecond surface, in which the transparent conductive film is connected tothe electrode pad, and the penetrating electrode is connected to theexternal connection terminal on the side of the second surface of thesubstrate.

According to another embodiment of the present disclosure, there isprovided a camera module including an image pickup apparatus includingan optical element area for receiving light, and a lens configured toform a subject image on the optical element area of the image pickupapparatus, in which the image pickup apparatus includes an opticaldevice in which an optical element area for receiving light is formed ona side of a first surface of a substrate, and an external connectionterminal is formed on a side of a second surface opposite to the firstsurface of the substrate, a transparent conductive film formed to facethe first surface of the substrate, an electrode pad formed on the firstsurface of the substrate and configured to perform connection with afixed potential, and a penetrating electrode connected to the electrodepad and formed to penetrate the substrate between the first surface andsecond surface, the transparent conductive film is connected to theelectrode pad, and the penetrating electrode is connected to theexternal connection terminal on the side of the second surface of thesubstrate.

According to the embodiments of the present disclosure, it is possibleto sufficiently exert an EMC or EMI effect while preventing an increasein size of the module, a complication of the process, and an increase incost.

These and other objects, features and advantages of the presentdisclosure will become more apparent in light of the following detaileddescription of best mode embodiments thereof, as illustrated in theaccompanying drawings.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a view showing a basic structure of a WCSP structure;

FIG. 2 is a view showing the structure of a WCSP structure with nocavity;

FIGS. 3A and 3B are views each showing a first structural example of animage pickup apparatus according to a first embodiment;

FIG. 4 is a view showing a structural example of a color filteraccording to the first embodiment;

FIGS. 5A and 5B are views each showing a second structural example of animage pickup apparatus according to a second embodiment;

FIGS. 6A and 6B are views each showing a third structural example of animage pickup apparatus according to a third embodiment;

FIGS. 7A and 7B are views each showing a fourth structural example of animage pickup apparatus according to a fourth embodiment;

FIGS. 8A and 8B are views each showing a fifth structural example of animage pickup apparatus according to a fifth embodiment; and

FIG. 9 is a view showing a structural example of a camera moduleaccording to a sixth embodiment.

DETAILED DESCRIPTION OF EMBODIMENTS

Hereinafter, embodiments of the present disclosure will be describedwith reference to the drawings.

It should be noted that the description will be given in the followingorder.

1. First structural example of image pickup apparatus

2. Second structural example of image pickup apparatus

3. Third structural example of image pickup apparatus

4. Fourth structural example of image pickup apparatus

5. Fifth structural example of image pickup apparatus

6. Structural example of camera module

<1. First Structural Example of Image Pickup Apparatus>

FIGS. 3A and 3B are views each showing a first structural example of animage pickup apparatus according to a first embodiment.

FIG. 3A is a plan view showing the structural example in which atransparent conductive film is disposed on a first surface side of asubstrate, and FIG. 3B is a schematic side view showing the entirestructure of the image pickup apparatus.

In this embodiment, as an optical device (optical sensor), a CMOS imagesensor (CIS) is applied as an example.

An image pickup apparatus 100 according to this embodiment basically hasa WCSP structure which performs packaging with an optical sensor chipsize.

The image pickup apparatus 100 is capable of employing either a cavitystructure in which a cavity is formed between an optical element area(light receiving unit) of the optical device and an opposed surface ofsealing glass with respect to the light receiving unit or a cavitylessWCSP structure with no cavity.

In this embodiment, the first surface (front surface) means an incidentside of image light of a subject, on which the light receiving unit ofthe optical device as the optical sensor of the image pickup apparatusis formed, and a second surface (back surface) means a side opposite tothe first side. On the second surface, light is not incident, and aconnection electrode such as a bump, an interposer, and the like aredisposed.

The image pickup apparatus 100 has an optical device 110, a sealingmaterial 120, a transparent conductive film 130 serving as anintermediate layer, electrode pads 140 (−1 to −4), another connectionpad 150 serving as an external connection terminal, penetratingelectrodes 160 (−1, −2), and an external connection terminal 170.

In this embodiment, the electrode pad 140 is a pad for a ground terminalfor connecting to a fixed potential (ground potential in this example).

In this embodiment, as will be described later, the transparentconductive film 130 is connected to the electrode pad 140 and connectedto the external connection terminal 170 through the penetratingelectrode 160 connected to the electrode pad, and the externalconnection terminal 170 is connected to an external reference potential(ground potential).

With this structure, the transparent conductive film 130 also functionsas a shield material in addition to the function of a protection film ofthe optical element area.

It should be noted that the transparent conductive film 130 and thesealing material 120 are formed of a transparent material with respectto light, which causes light to pass therethrough, and those materialseach have a refractive index higher than the refractive index of air.For example, the sealing material 120 is formed of a material having arefractive index of approximately 1.5.

Further, in the structure shown in FIG. 3B, the sealing material 120 ismade of glass as an example, and the sealing material 120 refers to asealing glass or a cover glass in some cases.

In the optical device 110, an optical element area 112 functioning asthe light receiving unit is formed on the side of a first surface (frontsurface) 111 a of a sensor substrate 111, and the external connectionterminal 170 serving as an electrode for connection with the outside,such as a bump, is formed on the side of a second surface (back surface)111 b.

In the optical device 110, on a side portion (on the right and left sideportions in FIG. 3A) on the first surface 111 a side of the sensorsubstrate 111, the electrode pads 140 (−1 to −4) and the connection pad150 in addition thereto are formed.

In the optical device 110, in an area excluding a filter part of theoptical element area 112 on the first surface 111 a of the sensorsubstrate 111, an insulation film 113 is formed.

On the side of the first surface 111 a of the sensor substrate 111, theelectrode pads 140 are formed so as to be opened and exposed in such amanner that the electrode pads 140 are buried in the insulation film 113to be electrically connected to the transparent conductive film 130.

The connection pad 150 serving as the external connection terminalformed on the first surface 111 a of the sensor substrate 111 of theoptical device 110 may be opened or may not be opened as a wire bondingpad. Further, the pad may not be a metal layer on an uppermost layer ofstacked wirings in the optical device 110.

It should be noted that the “opened” refers to a directly connectablestate in which the insulation film 113 is removed to expose the pad.

In the optical device 110, the penetrating electrodes 160 (−1, −2) areformed by through silicon vias (TSV) 114 that penetrate the sensorsubstrate 111 between the first surface 111 a and the second surface 111b. With this structure, the wirings using the wire bonding areeliminated, and the glass can be bonded in a wafer state in a cleanroom.

The penetrating electrodes 160 (−1 to −4) are connected to the externalconnection terminal 170 connected to the external reference potential(ground potential) by a wiring 115 on the side of the second surface 111b of the sensor substrate 111.

The optical element area 112 serving as the light receiving unit isformed on the first surface 111 a of the sensor substrate 111 and has alight receiving surface (pixel array unit) 1121 on which a plurality ofpixels (light receiving elements) are arranged in a matrix pattern.

In the optical element area 112, on the front surface side of the pixelarray unit 1121, a color filter 1122 is formed.

In the color filter 1122, color filters of three primary colors of R(red), G, (green), and B (blue) are formed in an array manner as on-chipcolor filters (OCCF) in the Bayer arrangement as shown in FIG. 4, forexample. However, the arrangement pattern of the color filters is notlimited to the Bayer arrangement.

It should be noted that, in the example of FIG. 4, an infrared cutofffilter (IRCF) 180 is formed so as to be overlapped with the color filter1122.

In the optical element area 112, a micro lens array 1123 for collectingincident light to pixels is arranged on the front surface side of thecolor filter 1122.

In the optical element area 112, on the front surface side of the microlens array 1123, an antireflection film or the like is formed, forexample.

The transparent conductive film 130 is formed so as to fill a gapbetween the first surface 111 a of the sensor substrate 111 on which theoptical element area 112 having the structure mentioned above is formedand an opposed surface 121 of the sealing material (sealing glass) 120with respect to the first surface 111 a.

That is, the image pickup apparatus 100 according to the firstembodiment is formed as so-called a cavityless structure.

It should be noted that the thickness of the transparent conductive film130 is set to approximately 50 μm, for example. Further, the thicknessof the sealing glass 120 is set to approximately 450 to 500 μm, forexample.

The transparent conductive film 130 is formed of a transparent organicfilm or the like, in which conductive particles such as an ITO (IndiumTin Oxide) and ZnO2 (Zinc peroxide) are dispersed.

The transparent conductive film 130 is subjected to patterning into ashape as shown in FIG. 3A in the case where the connection pad 150serving as the external connection terminal formed on the first surface111 a of the sensor substrate 111 of the optical device 110 is opened asthe wire bonding pad.

That is, the transparent conductive film 130 is subjected to thepatterning so as to have cutoff portions 131-1 and 131-2 obtained byremoving parts of the transparent conductive film 130 so that the wirebonding pad is not electrically connected to (not brought into contactwith) the transparent conductive film.

Further, in the first embodiment, the transparent conductive film 130 isformed so as to cover the optical element area 112, and a part thereofthat is electrically connected with the optical device 110 and exerts aninfluence is formed so as to be non-contact electrically.

The insulation film 113 is formed in an area excluding the opticalelement area 112 in the first surface 111 a of the sensor substrate 111so as to be non-contact with the transparent conductive film 130 on theside of the optical device 110. Alternatively, the transparentconductive film 130 is subjected to the patterning so as to avoid thepart that is electrically connected and exerts the influence in theoptical device 110.

The image pickup apparatus 100 having the structure described above ismanufactured basically as follows.

In the optical device 110, the transparent conductive film 130 is bondedwith the glass 120 having the same size as the optical device 110 withan optically transparent adhesive at a wafer level.

After that, silicon on a second surface side, which is opposite to thefirst surface on which the optical element area 112 of the opticaldevice 110 is formed, is cut away up to such a thickness that thepenetrating electrode 160 can be formed.

Then, the through silicon via 114 for forming the penetrating electrode160, which is connected with the external connection terminal 170 isformed, the insulation film 113 is formed, the re-wiring 115 is formed,and a protection film 116 is formed. Then, the matter thus obtained isdivided into pieces of the size of each optical device 110, with theresult that the WCSP of the optical device is completed.

In the image pickup apparatus 100 according to this embodiment, thetransparent conductive film 130 is connected with the electrode pad 140and is connected with the external connection terminal 170 through thepenetrating electrode 160 connected to the electrode pad 140, and theexternal connection terminal 170 is connected with an external referencepotential (ground potential).

With this structure, the transparent conductive film 130 functions asthe shield material in addition to the function of the protection filmof the optical element area, and the optical device 110 is covered withan EMC (Electro-Magnetic Compatibility) shield.

<2. Second Structural Example of Image Pickup Apparatus>

FIGS. 5A and 5B are views each showing a second structural example of animage pickup apparatus according to a second embodiment.

FIG. 5A is a plan view showing a structural example in which atransparent conductive film is disposed on a first surface side of asubstrate, and FIG. 5B is a schematic side view showing an entirestructure of the image pickup apparatus.

An image pickup apparatus 100A according to the second embodiment isdifferent from the image pickup apparatus 100 according to the firstembodiment in the following points.

In the image pickup apparatus 100A according to the second embodiment, atransparent conductive film 130A is formed so as to have a moth eyestructure (MEY) showing optical characteristics by a fine structurepattern having a regular unevenness of a sub-micron order (e.g., 100 μmto 500 μm).

The reason why the moth eye structure is used for the transparentconductive film 130A is described as follows.

An ITO or ZnO2 used as a general transparent conductive film has a highrefractive index of 1.9 to 2.0, so when such a transparent conductivefilm is formed with a flat structure, a large reflection is caused,which may degrade the optical characteristics.

In view of this, in the second embodiment, in order to avoid increasingthe reflection and degrading the optical characteristics, the moth eyestructure is employed.

Further, at this time, it is desirable that the refractive index of anoptical element material is as high as possible, and the refractiveindex of 1.6 or more is necessary.

The moth eye structure is formed in a photoresist process by dry etchingor wet etching.

The optical device having the moth eye structure formed is bonded withthe sealing glass 120 with a transparent adhesive 190 with less opticalcharacteristic degradation. As a result, a WCSP having a cavitylessstructure is formed.

Also in the image pickup apparatus 100A according to the secondembodiment, the electrode pad 140 serving as a ground terminal on theoptical device 110 is opened and is in contact with the transparentconductive film 130A to be electrically connected therewith. Theconnection pad 150 serving as another external connection terminal isnot opened and is therefore not be electrically connected with thetransparent conductive film 130A.

As described above, in the second embodiment, the transparent conductivefilm 130A is formed on a sensor surface with the moth eye structure.

The transparent conductive film 130A is connected with the electrode pad140 and is connected with the external connection terminal 170 throughthe penetrating electrode 160 connected to the electrode pad 140, andthe external connection terminal 170 is connected with an externalreference potential (ground potential).

As a result, the transparent conductive film 130A functions as theshield material, in addition to the function as the protection film ofthe optical element area, and the optical device 110 is covered with theEMC shield.

Other structures of the image pickup apparatus 100A are the same as theimage pickup apparatus 100.

<3. Third Structural Example of Image Pickup Apparatus>

FIGS. 6A and 6B are views each showing a third structural example of animage pickup apparatus according to a third embodiment.

FIG. 6A is a plan view showing a structural example in which atransparent conductive film is disposed on a first surface side of asubstrate, and FIG. 6B is a schematic side view showing an entirestructure of the image pickup apparatus.

An image pickup apparatus 100B according to the third embodiment isdifferent from the image pickup apparatus 100 according to the firstembodiment in the following points.

In the image pickup apparatus 100B according to the third embodiment, inorder to avoid degradation of the optical characteristics of thetransparent conductive film, a transparent conductive film 130B is notformed on the optical element area 112, although the effect of the EMCshield is reduced.

With this structure, the image pickup apparatus 100B according to thethird embodiment is structured as a cavity structure having an air layer(cavity) CVT which is disposed between the sealing glass 120 and theoptical device 110.

In the image pickup apparatus 100B, on the transparent conductive film130B formed outside the optical element area 112, an adhesive 190B(material which does not have to take the degradation of the opticalcharacteristics into consideration) is applied and is bonded with thesealing glass 120.

Alternatively, with an adhesive which is pattern-formed on the sealingglass 120 into an area shape thereof, the transparent conductive film isbonded with the sealing glass 120.

Other structures of the image pickup apparatus 100B are the same as theimage pickup apparatus 100.

<4. Fourth Structural Example of Image Pickup Apparatus>

FIGS. 7A and 7B are views each showing a fourth structural example of animage pickup apparatus according to this embodiment.

FIG. 7A is a plan view showing a structural example in which atransparent conductive film is disposed on a first surface side of asubstrate, and FIG. 7B is a schematic side view showing an entirestructure of the image pickup apparatus.

An image pickup apparatus 100C according to a fourth embodiment isdifferent from the image pickup apparatus 100B according to the thirdembodiment in the following points.

In the image pickup apparatus 100C according to the fourth embodiment, alarge number of holes 132 are formed to increase a surface area of atransparent conductive film 130C.

In the case where the shield effect of the transparent conductive filmis insufficient, by increasing the surface area (in particular, in adepth direction), it is possible to enhance the shield effect (see,Design technique for EMC, Part 4: shield,http://homepage3.nifty.com/tsato/dtemc/part4.html).

For this reason, in the fourth embodiment, the structure in which thetransparent conductive film 130C has arbitrary holes 132 is employed.

Further, surrounding the optical device 110 by the transparentconductive film is effective for the EMC measure. Therefore, in thefourth embodiment, the transparent conductive film 130C is formed on anopposed surface 121 (side surface of the optical device) of the sealingglass 120.

It is desirable that the transparent conductive film 130C is extremelyclose to a transmittance of 100% and the refractive index ofapproximately 1.5 of the glass.

As described above, in the fourth embodiment, in order to increase thesurface area of the transparent conductive film 130C, the large numberof holes 132 are formed. By the penetrating electrode 160 and theelectrode pad 140 serving as a ground terminal of the optical device 110and the transparent conductive film 130C, the connection to an externalground terminal is carried out.

As a result, the transparent conductive film 130C functions as theshield material, in addition to the function as the protection film ofthe optical element area, and the optical device 110 is covered with theEMC shield.

<5. Fifth Structural Example of Image Pickup Apparatus>

FIGS. 8A and 8B are views each showing a fifth structural example of animage pickup apparatus according to this embodiment.

FIG. 8A is a plan view showing a structural example in which atransparent conductive film is disposed on a first surface side of asubstrate, and FIG. 8B is a schematic side view showing an entirestructure of the image pickup apparatus.

An image pickup apparatus 100D according to a fifth embodiment isdifferent from the image pickup apparatus 100A according to the secondembodiment in the following points.

In the second embodiment, the transparent conductive film 130A has themoth eye structure.

In contrast, in the fifth embodiment, a cavityless WCSP using atransparent film 200 with a moth eye structure having no conductivity isachieved.

As described above, in the fifth embodiment, the transparent film 200 isformed on a sensor surface with the moth eye structure.

Then, the transparent conductive film 130D is connected with theelectrode pad 140 and is connected with the external connection terminal170 through the penetrating electrode 160 connected to the electrode pad140, and the external connection terminal 170 is connected to anexternal reference potential (ground potential).

With this structure, the transparent conductive film 130D functions asthe shield material in addition to the function as the protection filmof the optical element area, and the optical device 110 is covered withthe EMC shield.

Other structures of the image pickup apparatus 100D are the same as theimage pickup apparatus 100A.

According to the embodiments, the following effects can be obtained.

The WCSP which has been subjected to the EMC measure can be provided.

By providing the WCSP which has been subjected to the EMC measure, asmall, low-cost lens-integrated camera module can be provided.

By providing the cavityless WCSP, it is possible to attain a reductionin warp in a cavity area due to a reduction in thickness of the silicon,an increase in intensity of the cavity area, and a reduction in peelingof a spacer due to an increase in internal pressure of the cavity areaat the time of reflow.

There is no limitation of a shield film material of the lens-integratedcamera module, and a conductive or insulating material can be used.

Although an EMC resistance depends on the thickness of the conductivefilm, it is possible to adjust the EMC resistance in the WCSP byperforming control with the shape of the transparent conductive film.

Because the penetrating electrode allows the shield (transparentconductive film) to be connected with the external ground, it isunnecessary to consider a connection method between the externalconnection terminal on the lower surface and the conductive film formedon the side surface.

It is possible to apply the image pickup apparatuses 100 and 100A to100D described above to a camera module having an image pickup lens.

<6. Structural Example of Camera Module>

FIG. 9 is a view showing a structural example of a camera moduleaccording to this embodiment.

FIG. 9 shows a structural example of a lens-integrated camera module inthe case where the EMC measure is sufficiently conducted in the WCSPstructure. As an image pickup apparatus, the image pickup apparatus 100Aaccording to the second embodiment is used as an example, but the imagepickup apparatus 100, 100B, 100C, or 100D according to anotherembodiment can be applied thereto.

On the WCSP, an image pickup lens 310 is mounted with an adhesive 301,and a light shield film 332 is applied on a side surface.

In a camera module 300, the image pickup lens 310 which forms a subjectimage on the optical element area (light receiving unit) 112 of theoptical device (sensor) 110 is disposed on a front surface side (subjectside) of the image pickup apparatus 100A.

The camera module 300 has a signal processing unit (not shown) or thelike in addition to the image pickup lens 310.

In the camera module 300 having the above structure, an optical processis performed in the light receiving unit so that light from the subjecttaken by the image pickup lens 310 is easily converted into anelectrical signal in the image pickup apparatus. After that, the lightis guided to a photoelectric conversion unit of the optical device(sensor) 110, and the photoelectric conversion is performed to obtainthe electrical signal. Then, in a signal processing unit in a subsequentstage, a predetermined signal process is performed with respect to theelectrical signal obtained.

In the camera module according to this embodiment, it is also possibleto sufficiently exert the EMC or EMI effect while preventing an increasein size of the module, a complication of the process, and an increase incost.

It should be noted that the present disclosure can take the followingconfigurations.

(1) An image pickup apparatus, including:

-   -   an optical device in which an optical element area for receiving        light is formed on a side of a first surface of a substrate, and        an external connection terminal is formed on a side of a second        surface opposite to the first surface of the substrate;    -   a transparent conductive film formed to face the first surface        of the substrate;    -   an electrode pad formed on the first surface of the substrate        and configured to perform connection with a fixed potential; and    -   a penetrating electrode connected to the electrode pad and        formed to penetrate the substrate between the first surface and        second surface, in which    -   the transparent conductive film is connected to the electrode        pad, and    -   the penetrating electrode is connected to the external        connection terminal on the side of the second surface of the        substrate.

(2) The image pickup apparatus according to Item (1), in which

-   -   the transparent conductive film is formed as a moth eye        structure so that at least an area opposed to the optical        element area shows optical characteristics with a fine pattern.

(3) The image pickup apparatus according to Item (1), in which

-   -   in at least the area opposed to the optical element area, a        transparent film formed as a moth eye structure that shows        optical characteristics with a fine pattern is disposed.

(4) The image pickup apparatus according to any one of Items (1) to (3),in which

-   -   in at least a part of the transparent conductive film, a hole is        formed in a depth direction.

(5) The image pickup apparatus according to any one of Items (1) to (4),further including

-   -   a sealing material configured to protect a side of the optical        element area of the optical device, in which    -   the transparent conductive film is formed to fill a gap between        the first surface of the substrate including the optical element        area and a surface of the sealing material which is opposed to        the first surface.

(6) The image pickup apparatus according to any one of Items (1) to (4),in which

-   -   the transparent conductive film is formed in a non-contact state        with the optical element area.

(7) The image pickup apparatus according to Item (6), further including

-   -   a sealing material configured to protect a side of the optical        element area of the optical device, in which    -   the transparent conductive film is formed on a surface of the        sealing material, which is opposed to the optical element area,        across at least the optical element area and a cavity.

(8) The image pickup apparatus according to Item (6), in which

-   -   the transparent conductive film is formed on an area excluding        an area opposed to the optical element area.

(9) The image pickup apparatus according to any one of Items (1) to (8),in which

-   -   on the side of the first surface of the substrate, a pad        different from the electrode pad is formed, and the different        pad is in an electrically non-contact state with the transparent        conductive film.

(10) A camera module, including:

-   -   an image pickup apparatus including an optical element area for        receiving light; and    -   a lens configured to form a subject image on the optical element        area of the image pickup apparatus, in which    -   the image pickup apparatus includes    -   an optical device in which an optical element area for receiving        light is formed on a side of a first surface of a substrate, and        an external connection terminal is formed on a side of a second        surface opposite to the first surface of the substrate,    -   a transparent conductive film formed to face the first surface        of the substrate,    -   an electrode pad formed on the first surface of the substrate        and configured to perform connection with a fixed potential, and    -   a penetrating electrode connected to the electrode pad and        formed to penetrate the substrate between the first surface and        second surface,    -   the transparent conductive film is connected to the electrode        pad, and    -   the penetrating electrode is connected to the external        connection terminal on the side of the second surface of the        substrate.

(11) The camera module according to Item (10), in which

-   -   the transparent conductive film is formed as a moth eye        structure so that at least an area opposed to the optical        element area shows optical characteristics with a fine pattern.

(12) The camera module according to Item (10), in which

-   -   in at least the area opposed to the optical element area, a        transparent film formed as a moth eye structure that shows        optical characteristics with a fine pattern is disposed.

(13) The camera module according to any one of Items (10) to (12), inwhich

-   -   in at least a part of the transparent conductive film, a hole is        formed in a depth direction.

(14) The camera module according to any one of Items (10) to (13),further including

-   -   a sealing material configured to protect a side of the optical        element area of the optical device, in which    -   the transparent conductive film is formed to fill a gap between        the first surface of the substrate including the optical element        area and a surface of the sealing material which is opposed to        the first surface.

(15) The camera module according to any one of Items (10) to (13), inwhich

-   -   the transparent conductive film is formed in a non-contact state        with the optical element area.

(16) The camera module according to Item (15), further including

-   -   a sealing material configured to protect a side of the optical        element area of the optical device, in which    -   the transparent conductive film is formed on a surface of the        sealing material, which is opposed to the optical element area,        across at least the optical element area and a cavity.

(17) The camera module according to Item (15), in which

-   -   the transparent conductive film is formed on an area excluding        an area opposed to the optical element area.

It should be understood by those skilled in the art that variousmodifications, combinations, sub-combinations and alterations may occurdepending on design requirements and other factors insofar as they arewithin the scope of the appended claims or the equivalents thereof.

What is claimed is:
 1. An image pickup apparatus, comprising: an opticaldevice having a front side that includes an optical element area and aback side that includes an external connection terminal, wherein thefront side is configured to receive light and the back side is oppositeto the front side; a sealing material arranged above the front side ofthe optical device; a transparent conductive layer arranged between thefront side of the optical device and the sealing material; a firstelectrode pad arranged on the front side of the optical device; a secondpad that is different from the first electrode pad and is arranged in afirst area on the front side of the optical device, wherein thetransparent conductive layer is configured to fill a gap that excludesthe first area in which the different pad is provided; and a penetratingelectrode electrically connected to the first electrode pad, wherein thetransparent conductive layer is electrically connected to the firstelectrode pad, and wherein the penetrating electrode is connected to theexternal connection terminal on the back side of the optical device. 2.The image pickup apparatus according to claim 1, wherein the transparentconductive layer is a moth eye structure, and wherein at least a secondarea opposed to the optical element area shows optical characteristicswith a fine pattern.
 3. The image pickup apparatus according to claim 1,wherein at least a second area opposed to the optical element areacomprises a transparent film as a moth eye structure that shows opticalcharacteristics with a fine pattern.
 4. The image pickup apparatusaccording to claim 1, wherein the transparent conductive layer comprisesat least one region that has a cut-out region in a depth direction. 5.The image pickup apparatus according to claim 1, wherein the sealingmaterial is configured to protect the optical element area of theoptical device.
 6. The image pickup apparatus according to claim 1,wherein the second pad is indirectly connected with the transparentconductive layer.
 7. The image pickup apparatus according to claim 1,wherein the first electrode pad is configured to connect with a fixedpotential.
 8. The image pickup apparatus according to claim 1, whereinthe sealing material is a glass.
 9. The image pickup apparatus accordingto claim 1, wherein the penetrating electrode is a through silicon via(TSV) connection.
 10. The image pickup apparatus according to claim 1,wherein the transparent conductive layer is in indirect contact with theoptical element area.
 11. The image pickup apparatus according to claim10, wherein the sealing material is configured to protect the opticalelement area of the optical device, wherein the transparent conductivelayer is arranged on a surface of the sealing material, which is opposedto the optical element area.
 12. The image pickup apparatus according toclaim 10, wherein the transparent conductive layer is arranged in aregion excluding a second area opposed to the optical element area. 13.A camera module, comprising: at least one lens configured to form asubject image on an optical element area; and an image pickup apparatus,comprising: an optical device having a front side that includes theoptical element area and a back side that includes an externalconnection terminal, wherein the front side is configured to receivelight and the back side is opposite to the front side; a sealingmaterial arranged above the front side of the optical device; atransparent conductive layer arranged between the front side of theoptical device and the sealing material; a first electrode pad arrangedon the front side of the optical device; a second pad that is differentfrom the first electrode pad and is arranged in a first area on thefront side of the optical device, wherein the transparent conductivelayer is configured to fill a gap that excludes the first area in whichthe different pad is provided, and a penetrating electrode electricallyconnected to the first electrode pad, wherein the transparent conductivelayer is electrically connected to the first electrode pad, and whereinthe penetrating electrode is connected to the external connectionterminal on the back side of the optical device.
 14. The camera moduleaccording to claim 13, wherein the transparent conductive layer is amoth eye structure, and wherein at least a second area opposed to theoptical element area shows optical characteristics with a fine pattern.15. The camera module according to claim 13, wherein at least a secondarea opposed to the optical element area comprises a transparent film asa moth eye structure that shows optical characteristics with a finepattern.
 16. The camera module according to claim 13, wherein thetransparent conductive layer comprises at least one region that has acut-out region in a depth direction.
 17. The camera module according toclaim 13, wherein the sealing material is configured to protect theoptical element area of the optical device.
 18. The camera moduleaccording to claim 13, wherein the transparent conductive layer is inindirect contact with the optical element area.
 19. The camera moduleaccording to claim 18, wherein the sealing material is configured toprotect the optical element area of the optical device, wherein thetransparent conductive layer is arranged on a surface of the sealingmaterial, which is opposed to the optical element area.
 20. The cameramodule according to claim 18, wherein the transparent conductive layeris provided in a region excluding a second area opposed to the opticalelement area.